Parameters |
Mount |
Surface Mount |
Package / Case |
TFSOP |
Number of Pins |
56 |
Packaging |
Tape & Reel (TR) |
Max Operating Temperature |
85°C |
Min Operating Temperature |
-40°C |
Direction |
Unidirectional |
High Level Output Current |
18mA |
Low Level Output Current |
18mA |
Length |
11.3mm |
Width |
4.4mm |
Thickness |
1mm |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
74ALVCF162835APFG8 Overview
A copy of it is embedded in the package TFSOP. In this case, it is packaged in the same way as Tape & Reel (TR). In this case, the electronic part will be mounted in the Surface Mount-direction. The 56 pins are designed to be a part of it. A high level output current is defined as 18mA. As far as the operating temperature is concerned, it should be higher than -40°C. The operating temperature should be lower than 85°C.
74ALVCF162835APFG8 Features
TFSOP package
56 pins
74ALVCF162835APFG8 Applications
There are a lot of Integrated Device Technology (IDT) 74ALVCF162835APFG8 Universal Bus Functions applications.
- Mountain power station
- Electric car
- Microprocessors
- Grid adaptation function
- Photovoltaic grid-connected power system
- automatic temperature control circuits
- Overcurrent/Short circuit protection
- Automatic digital control circuits
- Server
- Residual current/leakage current protection