Parameters |
Mounting Type |
Surface Mount |
Package / Case |
48-TFSOP (0.240, 6.10mm Width) |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C TA |
Packaging |
Tube |
Series |
74ALVCH |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
2 (1 Year) |
Number of Terminations |
48 |
Terminal Finish |
MATTE TIN |
Technology |
CMOS |
Voltage - Supply |
1.65V~3.6V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
4 |
Supply Voltage |
1.8V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
48 |
Qualification Status |
COMMERCIAL |
Output Type |
3-State |
Number of Elements |
4 |
Supply Voltage-Max (Vsup) |
3.6V |
Supply Voltage-Min (Vsup) |
1.65V |
Number of Ports |
2 |
Number of Bits |
4 |
Family |
ALVC/VCX/A |
Current - Output High, Low |
24mA 24mA |
Logic Type |
Buffer, Non-Inverting |
Output Polarity |
TRUE |
Propagation Delay (tpd) |
6 ns |
Height Seated (Max) |
1.2mm |
Length |
12.5mm |
Width |
6.1mm |
RoHS Status |
ROHS3 Compliant |
74ALVCH16244T Overview
Logical driver uses a neat 48-TFSOP (0.240, 6.10mm Width) package. Tube external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 1.65V~3.6V. Qualified to operate within -40°C~85°C TA. The high and low logic state output current of logical driver is 24mA 24mA. Logical driver can deal with 3-State output (s). All of the 4 elements are put into use. Digital buffer is one of the 74ALVCH series devices. 48 terminations with different functions. Buffer IC reuqires a supply voltage of 1.8V. ALVC/VCX/A family part. 48 pins are set with the electric part. Enhanced with 2 ports. To supply the device, a minimum voltage of 1.65V is a must. 4 bits are included within the electrical component.
74ALVCH16244T Features
74ALVCH16244T Applications
There are a lot of Rochester Electronics, LLC 74ALVCH16244T Buffers & Transceivers applications.
- Laser diode bonding
- AV receiver
- Optical sub-assembly (OSA)
- Thermal management
- 1x/2x Fiber Channel
- Military satellite communications
- Cordless telephone
- Lamps
- Data center
- Televisions