Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
6-XFDFN |
Number of Pins |
6 |
Operating Temperature |
-40°C~125°C TA |
Packaging |
Tape & Reel (TR) |
Published |
2013 |
Series |
74AUP |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
6 |
Technology |
CMOS |
Voltage - Supply |
0.8V~3.6V |
Terminal Position |
DUAL |
Terminal Form |
NO LEAD |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Number of Functions |
2 |
Supply Voltage |
1.1V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
6 |
Output Type |
Push-Pull |
Number of Elements |
2 |
Supply Voltage-Min (Vsup) |
0.8V |
Family |
AUP/ULP/V |
Logic Function |
Buffer, Inverting |
Current - Output High, Low |
4mA 4mA |
Logic Type |
Buffer, Non-Inverting |
Number of Bits per Element |
1 |
Height Seated (Max) |
0.5mm |
RoHS Status |
ROHS3 Compliant |
74AUP2G16GMH Overview
Logical driver uses a neat 6-XFDFN package. Tape & Reel (TR) external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 0.8V~3.6V. Qualified to operate within -40°C~125°C TA. The high and low logic state output current of logical driver is 4mA 4mA. Logical driver can deal with Push-Pull output (s). All of the 2 elements are put into use. Digital buffer is one of the 74AUP series devices. 6 terminations with different functions. Buffer IC reuqires a supply voltage of 1.1V. Electronic parts from the AUP/ULP/V family are used in this part. 6 pins are set with the electric part. Buffer IC is suitable for Surface Mount applications. Logical driver has 6 pins. The bus transceiver employs 1 bits for each element. To supply the device, a minimum voltage of 0.8V is a must.
74AUP2G16GMH Features
74AUP2G16GMH Applications
There are a lot of Nexperia USA Inc. 74AUP2G16GMH Buffers & Transceivers applications.
- Radio transmission
- Ethernet circuitry
- IP cameras
- Data center
- Laser diode bonding
- Interconnection between switches and computers
- Changeing the frequency from IF to RF
- TV signal transmission
- Wireless security systems
- Wireless teaching