74AVC4T245PW
| Parameters | |
|---|---|
| Package / Case | TSSOP |
| Surface Mount | YES |
| Number of Pins | 16 |
| Published | 2005 |
| JESD-609 Code | e4 |
| Moisture Sensitivity Level (MSL) | 1 |
| Number of Terminations | 16 |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Technology | CMOS |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 2 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.65mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Temperature Grade | AUTOMOTIVE |
| Number of Circuits | 12 |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 800mV |
| Number of Ports | 2 |
| Number of Bits | 2 |
| Propagation Delay | 3.3 ns |
| Family | AVC |
| Data Rate | 380 Mbps |
| Number of Inputs | 1 |
| Output Characteristics | 3-STATE |
| Output Polarity | TRUE |
| Logic IC Type | BUS TRANSCEIVER |
| Ambient Temperature Range High | 125°C |
| Height | 1.1mm |
| Length | 5mm |
| Width | 4.4mm |
| REACH SVHC | No SVHC |
| RoHS Status | RoHS Compliant |
74AVC4T245PW Overview
Logical driver uses a neat TSSOP package. 16 terminations with different functions. Buffer IC reuqires a supply voltage of 1.2V. Transceiver shares the AVC family's comprehensive benefits and features. Logical driver has 16 pins. Enhanced with 2 ports. 2 bits are included within the electrical component. Voltage buffer is capable of operating under temperature as low as -40°C. Digital buffer should operate with ambient temperature no higher than 125°C. Voltage used to run voltage buffer should be 800mV at least. In regard to the maximum supply voltage, buffer driver is rated 3.6V. It is known as a BUS TRANSCEIVER logic IC. Digital buffer is characterized to have 1 inputs. The fundamental operation of logical driver is based on 12 circuits.
74AVC4T245PW Features
BUS TRANSCEIVER Logic IC
74AVC4T245PW Applications
There are a lot of Nexperia 74AVC4T245PW Buffers & Transceivers applications.
- Structural bonding
- Changeing the frequency from IF to RF
- LAN, SAN, WAN (local, storage, work area networks)
- Televisions
- Fiber optic cable connection network
- Wireless smart house
- Transmission stations
- Single fiber bidirectional application
- Laser diode bonding
- Car radio
