74AXP1G07GMH
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 6-XFDFN |
| Number of Pins | 6 |
| Operating Temperature | -40°C~85°C TA |
| Packaging | Tape & Reel (TR) |
| Published | 2014 |
| Series | 74AXP |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 6 |
| Technology | CMOS |
| Voltage - Supply | 0.7V~2.75V |
| Terminal Position | DUAL |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 6 |
| Output Type | Open Drain |
| Number of Elements | 1 |
| Supply Voltage-Max (Vsup) | 2.75V |
| Supply Voltage-Min (Vsup) | 0.7V |
| Family | AXP |
| Logic Function | Buffer, Inverting |
| Current - Output High, Low | - 8mA |
| Logic Type | Buffer, Non-Inverting |
| Propagation Delay (tpd) | 82 ns |
| Height Seated (Max) | 0.5mm |
| RoHS Status | ROHS3 Compliant |
74AXP1G07GMH Overview
Logical driver uses a neat 6-XFDFN package. Tape & Reel (TR) external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 0.7V~2.75V. Qualified to operate within -40°C~85°C TA. The high and low logic state output current of logical driver is - 8mA. Logical driver can deal with Open Drain output (s). All of the 1 elements are put into use. Digital buffer is one of the 74AXP series devices. 6 terminations with different functions. Buffer IC reuqires a supply voltage of 1.2V. Electronic parts from the AXP family are used in this part. 6 pins are set with the electric part. Buffer IC is suitable for Surface Mount applications. Logical driver has 6 pins. To supply the device, a minimum voltage of 0.7V is a must.
74AXP1G07GMH Features
74AXP1G07GMH Applications
There are a lot of Nexperia USA Inc. 74AXP1G07GMH Buffers & Transceivers applications.
- Thermal management
- Carrier phase observations
- IPTV front end
- Military satellite communications
- Lamps
- IP cameras
- Sensor reporting
- Remote controls
- Optical sub-assembly (OSA)
- Transmission stations
