74F181PC
| Parameters | |
|---|---|
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | 24-DIP (0.600, 15.24mm) |
| Number of Pins | 24 |
| Supplier Device Package | 24-PDIP |
| Weight | 3.740011g |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Series | 74F |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Supply Voltage | 4.5V~5.5V |
| Base Part Number | 74F181 |
| Number of Circuits | 1 |
| Max Supply Voltage | 5.5V |
| Min Supply Voltage | 4.5V |
| Number of Bits | 4 |
| Propagation Delay | 12 ns |
| Logic Type | Arithmetic Logic Unit |
| High Level Output Current | -1mA |
| Low Level Output Current | 20mA |
| Height | 4.06mm |
| Length | 32.26mm |
| Width | 13.71mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
74F181PC Overview
Using Tube as a packaging method is common.You can find it in the 24-DIP (0.600, 15.24mm) package.In order to ensure that the device will work normally, the voltage 4.5V~5.5V is supplied.Electronic parts mounted in the way of Through Hole are referred to as this type.The operating temperature is set to 0°C~70°C.The memory features a size of 4 bits to store information.There are a number of similarities among the electronic parts of the 74F series.Based on the 74F181 base part number, many related parts can be found.The way of Through Hole is used to mount it.In its construction, there are 24 pins.With the minimum supply voltage set to 4.5V, normal use can be maintained.Normal use can be kept when the maximum supply voltage is kept at 5.5V.Keeping its operating temperature below 70°C is very crucial.Ensure that its operating temperature does not go below 0°C.With 1 circuits, it is configured.
74F181PC Features
74F181PC Applications
There are a lot of ON Semiconductor 74F181PC Specialty Logic ICs applications.
- Solenoids
- Tuner
- Cable network front end
- Digital systems
- Wireless HD Photography
- Vehicle, ship, aircraft navigation and positioning
- Laser diode bonding
- Wireless network systems
- Structural bonding
- IP cameras
