74F244SC
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 20-SOIC (0.295, 7.50mm Width) |
| Surface Mount | YES |
| Operating Temperature | 0°C~70°C TA |
| Packaging | Tube |
| Series | 74F |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 20 |
| Terminal Finish | MATTE TIN |
| Technology | TTL |
| Voltage - Supply | 4.5V~5.5V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 2 |
| Supply Voltage | 5V |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 20 |
| Qualification Status | Not Qualified |
| Output Type | 3-State |
| Number of Elements | 2 |
| Supply Voltage-Max (Vsup) | 5.5V |
| Number of Ports | 2 |
| Family | F/FAST |
| Current - Output High, Low | 3mA 64mA |
| Logic Type | Buffer, Non-Inverting |
| Output Polarity | TRUE |
| Number of Bits per Element | 4 |
| Propagation Delay (tpd) | 6.5 ns |
| Width | 7.5mm |
| RoHS Status | ROHS3 Compliant |
74F244SC Overview
Logical driver uses a neat 20-SOIC (0.295, 7.50mm Width) package. Tube external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 4.5V~5.5V. Qualified to operate within 0°C~70°C TA. The high and low logic state output current of logical driver is 3mA 64mA. Logical driver can deal with 3-State output (s). All of the 2 elements are put into use. Digital buffer is one of the 74F series devices. 20 terminations with different functions. Buffer IC reuqires a supply voltage of 5V. F/FAST family part. 20 pins are set with the electric part. Enhanced with 2 ports. The bus transceiver employs 4 bits for each element.
74F244SC Features
74F244SC Applications
There are a lot of Rochester Electronics, LLC 74F244SC Buffers & Transceivers applications.
- Metro access rings
- Remote controls
- Wireless multimedia center in smart home
- Carrier phase observations
- Single fiber bidirectional application
- Switches/bridges/routers/servers
- Structural bonding
- Laser diode bonding
- interconnection between computers
- Wireless projection application for conferences and business talks
