74HC40105PW,112
| Parameters | |
|---|---|
| Contact Plating | Gold |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 16-TSSOP (0.173, 4.40mm Width) |
| Number of Pins | 16 |
| Operating Temperature | -40°C~125°C |
| Packaging | Tube |
| Published | 2013 |
| Series | 74HC |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Voltage - Supply | 2V~6V |
| Frequency | 36MHz |
| Base Part Number | 74HC40105 |
| Function | Asynchronous |
| Operating Supply Voltage | 5V |
| Polarity | Non-Inverting |
| Number of Circuits | 1 |
| Memory Size | 64 16 x 4 |
| Propagation Delay | 750 ns |
| Quiescent Current | 8μA |
| Turn On Delay Time | 750 ns |
| Access Time | 34ns |
| Number of Inputs | 4 |
| High Level Output Current | -7.8mA |
| Low Level Output Current | 7.8mA |
| Bus Directional | Uni-Directional |
| FWFT Support | No |
| Expansion Type | Depth, Width |
| Height | 950μm |
| Length | 5.1mm |
| Width | 4.5mm |
| RoHS Status | RoHS Compliant |
74HC40105PW,112 Overview
The 16-TSSOP (0.173, 4.40mm Width) package contains FIFO memory chip.There is a case Tube in which it is packaged.Apps and data can be stored in the 64 16 x 4 memory of the FIFO chip.Keeping the temperature at -40°C~125°C will ensure reliable operation.Mounting type Surface Mount is assigned to the FIFO memory.It uses a supply voltage of 2V~6V to operate.The 74HC series contains this memory logic.The recommended mounting method for this FIFO products is Surface Mount .A member of the 74HC40105 family, it has the following characteristics.16 pins are used for operation.A supply voltage of 5V is recommended for FIFO's maximum efficiency.A frequency of 36MHz is sufficient to maintain good accuracy.Due to the use of 1 circuits, FIFO memory chip has an enhanced level of flexibility.
74HC40105PW,112 Features
64 16 x 4 memory size
74HC series
Best part number of 74HC40105
74HC40105PW,112 Applications
There are a lot of Nexperia USA Inc. 74HC40105PW,112 FIFOs Memory applications.
- Controlled baseline
- SPD for DDR3 Memory Modules
- Down-Hole Energy Drilling
- Test site
- Buses
- SPI Bus Flash Memory Devices
- General Data Collection Applications at Low-Temperatures
- Extended product-change notification
- Firmware loaders
- Signal processing
