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74LCX273FT(AJ)

1.65V~3.6V 135MHz D-Type Flip Flop 40μA 74LCX Series 20-TSSOP (0.173, 4.40mm Width)


  • Manufacturer: Toshiba Semiconductor and Storage
  • Nocochips NO: 830-74LCX273FT(AJ)
  • Package: 20-TSSOP (0.173, 4.40mm Width)
  • Datasheet: PDF
  • Stock: 934
  • Description: 1.65V~3.6V 135MHz D-Type Flip Flop 40μA 74LCX Series 20-TSSOP (0.173, 4.40mm Width)(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173, 4.40mm Width)
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Published 2014
Series 74LCX
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type D-Type
Voltage - Supply 1.65V~3.6V
Function Reset
Output Type Non-Inverted
Number of Elements 1
Clock Frequency 135MHz
Current - Quiescent (Iq) 40μA
Current - Output High, Low 24mA 24mA
Number of Bits per Element 8
Max Propagation Delay @ V, Max CL 9.5ns @ 3.3V, 50pF
Trigger Type Positive Edge
Input Capacitance 7pF
RoHS Status RoHS Compliant

74LCX273FT(AJ) Overview


The flip flop is packaged in a case of 20-TSSOP (0.173, 4.40mm Width). There is an embedded version in the package Tape & Reel (TR). T flip flop uses Non-Invertedas the output. JK flip flop uses Positive Edgeas the trigger. There is an electrical part that is mounted in the way of Surface Mount. A voltage of 1.65V~3.6Vis required for its operation. It is operating at a temperature of -40°C~125°C TA. This electronic flip flop is of type D-Type. The 74LCXseries comprises this type of FPGA. In order for it to function properly, its output frequency should not exceed 135MHz. In total, it contains 1 elements. As a result, it consumes 40μA of quiescent current without being affected by external factors. A JK flip flop with a 7pFfarad input capacitance is used here.

74LCX273FT(AJ) Features


Tape & Reel (TR) package
74LCX series

74LCX273FT(AJ) Applications


There are a lot of Toshiba Semiconductor and Storage 74LCX273FT(AJ) Flip Flops applications.

  • Supports Live Insertion
  • Data storage
  • Circuit Design
  • Bounce elimination switch
  • Power down protection
  • CMOS Process
  • Differential Individual
  • Event Detectors
  • Modulo – n – counter
  • Buffered Clock

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