Parameters |
Mounting Type |
Through Hole |
Package / Case |
20-DIP (0.300, 7.62mm) |
Supplier Device Package |
20-DIP |
Operating Temperature |
-40°C~125°C |
Packaging |
Tube |
Series |
74LV |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
1V~5.5V |
Output Type |
Tri-State |
Circuit |
8:8 |
Current - Output High, Low |
16mA 16mA |
Logic Type |
D-Type Transparent Latch |
Independent Circuits |
1 |
Delay Time - Propagation |
20ns |
RoHS Status |
ROHS3 Compliant |
74LV373N,112 Overview
The 20-DIP (0.300, 7.62mm) package contains it. Tube is the packaging method. It uses Tri-State as the output. There is D-Type Transparent Latch logic type for this electrical device. A Through Hole mount is used for mounting this electronic part. It operates at a voltage of 1V~5.5V. There is a temperature of -40°C~125°C at which the system operates. The 74LV series of FPGAs is the one this FPGA belongs to.
74LV373N,112 Features
20-DIP (0.300, 7.62mm) package
74LV series
74LV373N,112 Applications
There are a lot of Rochester Electronics, LLC 74LV373N,112 Latches applications.
- Up-Down Johnson
- Double bus register system
- Flip-flops
- Pattern Generators
- Multistage ripple counting
- Network Switches
- PCs and Notebooks
- Hammer
- Up/down difference counting
- Decade counting 7-segment decimal display