Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Tin |
Mount |
Surface Mount |
Package / Case |
SSOP |
Number of Pins |
48 |
Published |
2006 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 |
ECCN Code |
EAR99 |
Max Operating Temperature |
85°C |
Min Operating Temperature |
-40°C |
Pin Count |
48 |
Number of Outputs |
16 |
Operating Supply Voltage |
3.3V |
Polarity |
Non-Inverting |
Max Supply Voltage |
3.6V |
Min Supply Voltage |
3V |
Nominal Supply Current |
10μA |
Propagation Delay |
4.4 ns |
Quiescent Current |
10μA |
Turn On Delay Time |
6.9 ns |
Logic Function |
Buffer, Inverting |
High Level Output Current |
-12mA |
Low Level Output Current |
12mA |
Number of Input Lines |
4 |
Length |
15.9mm |
Width |
7.5mm |
Thickness |
2.3mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
74LVC162244APVG Overview
Logical driver uses a neat SSOP package. 48 pins are set with the electric part. Buffer IC is suitable for Surface Mount applications. Logical driver has 48 pins. In quiescent state, the electronic part uses 10μA. To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the logical driver. Voltage buffer is capable of operating under temperature as low as -40°C. Digital buffer should operate with ambient temperature no higher than 85°C. Buffer driver outputs 12mA to its low level. In high level output mode, the electronic parts may conduct -12mA of current. Voltage used to run voltage buffer should be 3V at least. In regard to the maximum supply voltage, buffer driver is rated 3.6V. Because of its 4 lines level input capability, buffer IC is more cost-effective on transimitting signals. It is sufficient to make 16 outputs.
74LVC162244APVG Features
High Level Output: 12mA
Low Level Output: -12mA
74LVC162244APVG Applications
There are a lot of Integrated Device Technology (IDT) 74LVC162244APVG Buffers & Transceivers applications.
- Pocket PC
- transmission relay
- Wireless multimedia center in smart home
- Sensor reporting
- Carrier phase observations
- High-speed computer links
- Portable radio
- Notebook
- Precision geodetic measurement
- Indoor ad hoc meeting