74LVT245WMX
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | ACTIVE (Last Updated: 2 days ago) |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 20-SOIC (0.295, 7.50mm Width) |
| Number of Pins | 20 |
| Weight | 801mg |
| Operating Temperature | -40°C~85°C TA |
| Packaging | Tape & Reel (TR) |
| Series | 74LVT |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Voltage - Supply | 2.7V~3.6V |
| Base Part Number | 74LVT245 |
| Output Type | 3-State |
| Operating Supply Voltage | 3.3V |
| Number of Elements | 1 |
| Polarity | Non-Inverting |
| Number of Channels | 8 |
| Propagation Delay | 4 ns |
| Turn On Delay Time | 7.1 ns |
| Logic Function | Inverting, Transceiver |
| Direction | Bidirectional |
| Current - Output High, Low | 32mA 64mA |
| Logic Type | Transceiver, Non-Inverting |
| Height | 2.35mm |
| Length | 13mm |
| Width | 7.6mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
74LVT245WMX Overview
Logical driver uses a neat 20-SOIC (0.295, 7.50mm Width) package. Tape & Reel (TR) external packaging. Available in Surface Mount. Voltage buffer adopts Transceiver, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 2.7V~3.6V. Qualified to operate within -40°C~85°C TA. The high and low logic state output current of logical driver is 32mA 64mA. Logical driver can deal with 3-State output (s). All of the 1 elements are put into use. Digital buffer is one of the 74LVT series devices. Buffer IC is suitable for Surface Mount applications. Logical driver has 20 pins. You can search "74LVT245" for other related electrical components. To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the logical driver. 8 channels for high quality communication.
74LVT245WMX Features
74LVT245WMX Applications
There are a lot of ON Semiconductor 74LVT245WMX Buffers & Transceivers applications.
- Desktop radio
- Relays
- 1x/2x Fiber Channel
- Structural bonding
- Cell phones
- Laser diode bonding
- Wireless projection application for conferences and business talks
- Cordless telephone
- Point-to-point networking
- interconnection between switches
