Parameters |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
20-SOIC (0.295, 7.50mm Width) |
Number of Pins |
20 |
Weight |
801mg |
Operating Temperature |
-40°C~85°C TA |
Packaging |
Tube |
Series |
74LVTH |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Voltage - Supply |
2.7V~3.6V |
Base Part Number |
74LVTH244 |
Output Type |
3-State |
Operating Supply Voltage |
3.3V |
Number of Elements |
2 |
Polarity |
Non-Inverting |
Propagation Delay |
3.9 ns |
Turn On Delay Time |
5.3 ns |
Logic Function |
AND, Buffer, Inverting |
Current - Output High, Low |
32mA 64mA |
Logic Type |
Buffer, Non-Inverting |
Number of Bits per Element |
4 |
Number of Input Lines |
8 |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
74LVTH244WM Overview
Logical driver uses a neat 20-SOIC (0.295, 7.50mm Width) package. Tube external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 2.7V~3.6V. Qualified to operate within -40°C~85°C TA. The high and low logic state output current of logical driver is 32mA 64mA. Logical driver can deal with 3-State output (s). All of the 2 elements are put into use. Digital buffer is one of the 74LVTH series devices. Buffer IC is suitable for Surface Mount applications. Logical driver has 20 pins. The bus transceiver employs 4 bits for each element. You can search "74LVTH244" for other related electrical components. To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the logical driver. Because of its 8 lines level input capability, buffer IC is more cost-effective on transimitting signals.
74LVTH244WM Features
74LVTH244WM Applications
There are a lot of ON Semiconductor 74LVTH244WM Buffers & Transceivers applications.
- Tuner
- Automation systems
- VoIP phones
- Cell phones
- Wireless projection application for conferences and business talks
- Wireless multimedia center in smart home
- Wireless 3D game
- TV signal transmission
- Wireless modems
- Structural bonding