Parameters |
Mounting Type |
Surface Mount |
Package / Case |
20-SOIC (0.209, 5.30mm Width) |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C TA |
Packaging |
Tube |
Series |
74LVX |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
20 |
Terminal Finish |
MATTE TIN |
Technology |
CMOS |
Voltage - Supply |
2V~3.6V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
2 |
Supply Voltage |
2.7V |
Time@Peak Reflow Temperature-Max (s) |
30 |
Pin Count |
20 |
Qualification Status |
COMMERCIAL |
Output Type |
3-State |
Number of Elements |
2 |
Supply Voltage-Max (Vsup) |
3.6V |
Supply Voltage-Min (Vsup) |
2V |
Number of Ports |
2 |
Family |
LV/LV-A/LVX/H |
Current - Output High, Low |
4mA 4mA |
Logic Type |
Buffer, Non-Inverting |
Output Polarity |
TRUE |
Number of Bits per Element |
4 |
Propagation Delay (tpd) |
17 ns |
Width |
5.3mm |
RoHS Status |
ROHS3 Compliant |
74LVX244SJ Overview
Logical driver uses a neat 20-SOIC (0.209, 5.30mm Width) package. Tube external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 2V~3.6V. Qualified to operate within -40°C~85°C TA. The high and low logic state output current of logical driver is 4mA 4mA. Logical driver can deal with 3-State output (s). All of the 2 elements are put into use. Digital buffer is one of the 74LVX series devices. 20 terminations with different functions. Buffer IC reuqires a supply voltage of 2.7V. In the LV/LV-A/LVX/H family, the electric component belongs. 20 pins are set with the electric part. Enhanced with 2 ports. The bus transceiver employs 4 bits for each element. To supply the device, a minimum voltage of 2V is a must.
74LVX244SJ Features
74LVX244SJ Applications
There are a lot of Rochester Electronics, LLC 74LVX244SJ Buffers & Transceivers applications.
- Lamps
- Satellite communications networks
- Structural bonding
- Optical sub-assembly (OSA)
- Single fiber bidirectional application
- Wireless 3D game
- Telecom and datacom networking applications
- IP cameras
- Shortwave receiver
- Changeing the frequency from IF to RF