Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Package / Case | TFBGA |
Number of Pins | 176 |
Published | 2006 |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Max Operating Temperature | 70°C |
Min Operating Temperature | 0°C |
Subcategory | Other Logic ICs |
Peak Reflow Temperature (Cel) | 260 |
Frequency | 410MHz |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 176 |
Number of Outputs | 56 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Polarity | Non-Inverting |
Max Supply Voltage | 1.9V |
Min Supply Voltage | 1.7V |
Number of Bits | 28 |
Propagation Delay | 3 ns |
Frequency (Max) | 410MHz |
Logic Function | Buffer |
High Level Output Current | -6mA |
Low Level Output Current | 6mA |
Clock Edge Trigger Type | Positive Edge |
Length | 15mm |
Width | 6mm |
Thickness | 1.2mm |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |