74SSTUBF32869ABKG
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | TFBGA |
| Number of Pins | 150 |
| Published | 2006 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 |
| Number of Terminations | 150 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other Logic ICs |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 0.65mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Pin Count | 150 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.9V |
| Polarity | Non-Inverting |
| Power Supplies | 1.8V |
| Temperature Grade | COMMERCIAL |
| Supply Voltage-Min (Vsup) | 1.7V |
| Number of Bits | 14 |
| Frequency (Max) | 340MHz |
| Family | SSTU |
| Logic Function | Buffer |
| Logic IC Type | D FLIP-FLOP |
| Trigger Type | POSITIVE EDGE |
| Propagation Delay (tpd) | 1.5 ns |
| Length | 13mm |
| Width | 8mm |
| Thickness | 1.2mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
