Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Package / Case | TFBGA |
Number of Pins | 150 |
Published | 2006 |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 |
Number of Terminations | 150 |
ECCN Code | EAR99 |
Terminal Finish | TIN SILVER COPPER |
Max Operating Temperature | 70°C |
Min Operating Temperature | 0°C |
HTS Code | 8542.39.00.01 |
Subcategory | Other Logic ICs |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 1.8V |
Terminal Pitch | 0.65mm |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 150 |
Qualification Status | Not Qualified |
Operating Supply Voltage | 1.9V |
Polarity | Non-Inverting |
Power Supplies | 1.8V |
Temperature Grade | COMMERCIAL |
Supply Voltage-Min (Vsup) | 1.7V |
Number of Bits | 14 |
Frequency (Max) | 340MHz |
Family | 32869 |
Logic Function | Buffer |
Output Characteristics | OPEN-DRAIN |
Logic IC Type | D FLIP-FLOP |
Trigger Type | POSITIVE EDGE |
Propagation Delay (tpd) | 3 ns |
Length | 13mm |
Width | 8mm |
Thickness | 1.2mm |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |