Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Material | Glass |
Mount | Through Hole |
Published | 2012 |
Series | 8000 |
Size / Dimension | 6.30Lx3.94W 160.02mmx100.08mm |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Pitch | 0.079 2.00mm |
Hole Diameter | 813 μm |
Proto Board Type | Breadboard, General Purpose |
Circuit Pattern | Pad Per Hole (Round) |
Height | 160mm |
Board Thickness | 1.57mm |
REACH SVHC | Unknown |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |