816-AG12D-ES
| Parameters | |
|---|---|
| Contact Material | Copper |
| Contact Plating | Lead, Tin |
| Mount | Vertical |
| Mounting Type | Through Hole |
| Package / Case | SOIC |
| Housing Material | Polyester |
| Number of Positions or Pins (Grid) | 16 (2 x 8) |
| Contact Material - Mating | Copper Alloy |
| Contact Material - Post | Copper Alloy |
| Operating Temperature | -55°C~105°C |
| Packaging | Tube |
| Published | 2011 |
| Series | 800 |
| JESD-609 Code | e0 |
| Feature | Open Frame |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Type | DIP, 0.3 (7.62mm) Row Spacing |
| Number of Positions | 16 |
| HTS Code | 8536.69.40.40 |
| Contact Finish - Mating | Tin-Lead |
| Current Rating (Amps) | 3A |
| Pitch - Mating | 0.100 2.54mm |
| Body Length or Diameter | 0.8 inch |
| Lead Pitch | 2.54mm |
| Number of Contacts | 16 |
| PCB Contact Pattern | RECTANGULAR |
| Body Breadth | 0.4 inch |
| Lead Length | 3.18mm |
| Body Depth | 0.18 inch |
| Contact Style | RND PIN-SKT |
| Contact Resistance | 10mOhm |
| Insulation Resistance | 5GOhm |
| Row Spacing | 7.62 mm |
| Mating Contact Pitch | 0.1 inch |
| ELV | Non-Compliant |
| Dielectric Withstanding Voltage | 1000VAC V |
| Data Rate | 40 Mbps |
| Receiver Hysteresis | 35 mV |
| Termination Post Length | 0.125 3.18mm |
| Pitch - Post | 0.100 2.54mm |
| Simplex/Duplex | Half Duplex |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet
