Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Material | Glass |
Mount | External |
Package / Case | Epoxy |
Published | 2005 |
Series | 8200 |
Size / Dimension | 10.00Lx4.00W 254.0mmx101.6mm |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Pitch | 0.100 2.54mm |
Hole Diameter | 0.037 (0.94mm) |
Proto Board Type | Breadboard, General Purpose |
Circuit Pattern | Pad Per Hole (Round) |
Height | 254mm |
Board Thickness | 0.062 1.57mm 1/16 |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |