Parameters | |
---|---|
Mounting Type | Through Hole |
Contact Shape | Square |
Insulation Material | Polybutylene Terephthalate (PBTP) |
Housing Material | Polyester |
PCB Mount Retention | Without |
Packaging | Tray |
Published | 2011 |
Series | AMPMODU HV-100 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Connector Type | Receptacle, Bottom or Top Entry |
Number of Positions | 3 |
Max Operating Temperature | 105°C |
Min Operating Temperature | -65°C |
Number of Rows | 1 |
Fastening Type | Push-Pull |
Contact Finish - Mating | Gold |
Contact Type | Female Socket |
Orientation | Vertical |
Depth | 2.52mm |
Insulation Height | 0.256 6.50mm |
Style | Board to Board |
Number of Positions Loaded | All |
Pitch - Mating | 0.100 2.54mm |
Insulation Color | Green |
Contact Length - Post | 0.120 3.05mm |
Contact Finish - Post | Tin |
Housing Color | Black, Green |
Lead Length | 3.1mm |
Contact Resistance | 12mOhm |
ELV | Compliant |
Sealable | No |
Height | 6.2mm |
Length | 7.62mm |
Plating Thickness | 3μm |
Contact Finish Thickness - Mating | 31.5μin 0.80μm |
Contact Finish Thickness - Post | 118.1μin 3.00μm |
Length - Tail | 3.05mm |
PCB Thickness | 1.6mm |
RoHS Status | RoHS Compliant |
Flammability Rating | UL94 V-0 |
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 5 days ago) |
Contact Material | Copper Alloy |
Contact Plating | Tin, Gold |
Mount | Through Hole |