82P20416DBFG8
| Parameters | |
|---|---|
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | BGA |
| Number of Pins | 484 |
| Published | 2009 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Circuits | 16 |
| Power Dissipation-Max | 3.1W |
| RoHS Status | RoHS Compliant |
82P20416DBFG8 Overview
A BGA package is used to reduce board space requirements.The telecom IC is composed of 16 circuits.The mounting is in the way of Surface Mount.The 484 pins on this interface are used for telecom.The temperature is set at the minimum value of -40°C to ensure normal operation.Ensure normal operation by setting the temperature to the maximum value of 85°C.
82P20416DBFG8 Features
Available in the BGA package
82P20416DBFG8 Applications
There are a lot of Integrated Device Technology (IDT) 82P20416DBFG8 Telecom applications.
- Set-Top Box
- Voice over packet gateways
- Frame Relay Switches and Access Devices (FRADS)
- Fiber Optic Terminals
- Central office (CO)
- Voice over IP/DSL
- T1/E1/J1 add/drop multiplexers (MUX)
- Channel Banks
- Intelligent PBX
- Network Multiplexing and Terminating Equipment
