82P2821BHG
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 640-BGA Exposed Pad |
| Supplier Device Package | 640-TEPBGA (31x31) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 1.8V 3.3V |
| Base Part Number | IDT82P2821 |
| Function | Line Interface Unit (LIU) |
| Interface | E1, J1, T1 |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
82P2821BHG Overview
Saving board space is achieved with the 640-BGA Exposed Pad package.A Tray-packing method is used to pack telecommunications equipment.Telecommunications equipment is mounted using Surface Mount.1 circuits make up this telecom IC .The voltage supplied to 1.8V 3.3V can improve efficiency.-40°C~85°C is the operating temperature that can be set for reliable performance.IDT82P2821 is the base part number, which can be used to find more related parts.
82P2821BHG Features
Available in the 640-BGA Exposed Pad package
82P2821BHG Applications
There are a lot of Renesas Electronics America Inc. 82P2821BHG Telecom applications.
- Central office
- Digital Cross-Connect Systems
- Fiber Optic Terminals
- CSU/DSU E1 Interface
- Integrated Multi-Service Access Platforms (IMAPs)
- Cable Modem
- ISDN Primary Rate Interface
- High-Density T1/E1/J1 interfaces for Multiplexers
- Channel Banks
- NIU
