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82P2916BFG

484 Terminations484 Pin Telecom device16 Circuits1 Functions


  • Manufacturer: Integrated Device Technology (IDT)
  • Nocochips NO: 378-82P2916BFG
  • Package: BGA
  • Datasheet: PDF
  • Stock: 436
  • Description: 484 Terminations484 Pin Telecom device16 Circuits1 Functions(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case BGA
Number of Pins 484
Published 2010
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 484
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
HTS Code 8542.39.00.01
Subcategory Digital Transmission Interfaces
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Pin Count 484
Power Supplies 1.83.3V
Temperature Grade INDUSTRIAL
Number of Circuits 16
Power Dissipation-Max 3.1W
Telecom IC Type INTERFACE CIRCUIT
Height Seated (Max) 1.7mm
Length 19mm
Width 19mm
Thickness 1.76mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

82P2916BFG Overview


Saving board space is achieved with the BGA package.The telecom IC is composed of 16 circuits.A Surface Mount-axis mounts telecom switching.In telecom switching configuration, 484 terminations are present.It operates at voltage 1.8V.The telecom interface has 484 pins.Telecom ICs are of type INTERFACE CIRCUIT.Digital Transmission Interfaces subcategories telecommunications device .A minimum temperature value -40°C is set to ensure normal operation.Normal operation is ensured by setting 85°C to the maximum value.When designing, it is configured with 1 functions.484 telecom products have pins designed specifically for their configuration.

82P2916BFG Features


Available in the BGA package
INTERFACE CIRCUIT as telecom IC type

82P2916BFG Applications


There are a lot of Integrated Device Technology (IDT) 82P2916BFG Telecom applications.

  • Remote wireless modules
  • Channel Banks
  • Central office (CO)
  • Dual battery supply voltage SLICs
  • PBXs channel bank
  • Integrated Access Devices (IADs)
  • DECT (Digital European Cordless Telephone) Base
  • Switching Systems
  • Digital Cross Connect Systems
  • Cable Modem

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