Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
484 |
Packaging |
Tape & Reel (TR) |
Published |
2016 |
JESD-609 Code |
e1 |
Moisture Sensitivity Level (MSL) |
3 |
Number of Terminations |
484 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Max Operating Temperature |
85°C |
Min Operating Temperature |
-40°C |
Subcategory |
Digital Transmission Interfaces |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Supply Voltage |
1.8V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
30 |
Qualification Status |
Not Qualified |
Power Supplies |
1.83.3V |
Temperature Grade |
INDUSTRIAL |
Number of Circuits |
16 |
Power Dissipation-Max |
3.1W |
Telecom IC Type |
INTERFACE CIRCUIT |
RoHS Status |
RoHS Compliant |
82P2916BFG8 Overview
The BGA package reduces the amount of space on a board.To pack telecommunications equipment, the way of Tape & Reel (TR) is used.This telecom IC is composed of 16 circuits.A Surface Mount-axis mount is used.As part of its configuration, it includes 484 terminations.There is a voltage supply called 1.8V that it uses.The 484 pins on this interface are used for telecom.Telecom ICs are of type INTERFACE CIRCUIT.Digital Transmission Interfaces is a subcategory of telecommunications device .A minimum temperature value -40°C is set to ensure normal operation.In order to ensure normal operation of the telecom circuit, the temperature is set at the maximum value of 85°C.A 1 function is configured when designing.
82P2916BFG8 Features
Available in the BGA package
INTERFACE CIRCUIT as telecom IC type
82P2916BFG8 Applications
There are a lot of Integrated Device Technology (IDT) 82P2916BFG8 Telecom applications.
- Fiber Optic Terminals
- ATM Switches
- CSU/DSU E1/T1/J1 Interface
- ISDN NT1/TA
- Routers
- Home Gateway
- E1 Network Equipment
- Remote wireless modules
- Fault Tolerant Systems
- LAN Routers