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82V2058LBB

Telecom device


  • Manufacturer: Integrated Device Technology (IDT)
  • Nocochips NO: 378-82V2058LBB
  • Package: BGA
  • Datasheet: -
  • Stock: 221
  • Description: Telecom device(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case BGA
Max Operating Temperature 85°C
Min Operating Temperature -40°C
RoHS Status Non-RoHS Compliant

82V2058LBB Overview


BGA package is used to save board space.Telecom switching is mounted in the way of Surface Mount.Temperature should be set at the minimum value of -40°C to ensure normal operation.Normal operation is ensured by setting 85°C to the maximum value.

82V2058LBB Features


Available in the BGA package

82V2058LBB Applications


There are a lot of Integrated Device Technology (IDT) 82V2058LBB Telecom applications.

  • Dual battery supply voltage SLICs
  • T1 Rates PCM Line Interface
  • Digital loop carrier (DLC)
  • T1/E1/J1 add/drop multiplexers (MUX)
  • Cable Telephony
  • Digital Cross-connect Systems (DCS)
  • Digital Access Cross-connect System (DACs)
  • PBX interfaces
  • Fiber to the Home (FTTH)
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations

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