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82V2058LBBG

Telecom device


  • Manufacturer: Integrated Device Technology (IDT)
  • Nocochips NO: 378-82V2058LBBG
  • Package: BGA
  • Datasheet: -
  • Stock: 710
  • Description: Telecom device(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case BGA
Max Operating Temperature 85°C
Min Operating Temperature -40°C
RoHS Status RoHS Compliant

82V2058LBBG Overview


Space is saved on the board by using the BGA package.Telecom switching is mounted in a Surface Mount-direction.To ensure normal operation, -40°C must be set at a minimum value.The temperature is set at the maximum value of 85°C to ensure normal operation.

82V2058LBBG Features


Available in the BGA package

82V2058LBBG Applications


There are a lot of Integrated Device Technology (IDT) 82V2058LBBG Telecom applications.

  • PBXs channel bank
  • Private branch exchange (PBX)
  • Add/Drop multiplexers (ADMs)
  • Stations
  • CSU/DSU E1/T1/J1 Interface
  • Routers
  • DSLAMs
  • Multichannel DS1 Test Equipment
  • E1 Network Equipment
  • Digital subscriber line access multiplexer (DSLAM)

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