Parameters | |
---|---|
Mount | Surface Mount |
Material | Copper |
Shape | Rectangular, Fins |
Package Cooled | TO-263 (D2Pak) |
Material Finish | Tin |
Published | 2006 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Top Mount |
Packing Method | BULK |
Attachment Method | SMD Pad |
Height Off Base (Height of Fin) | 0.390 9.91mm |
Thermal Resistance @ Forced Air Flow | 10.00°C/W @ 200 LFM |
Power Dissipation @ Temperature Rise | 1.3W @ 30°C |
Device Used On | TRANSISTOR |
Height | 9.1mm |
Length | 0.500 12.70mm |
Width | 1.031 26.20mm |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |