833900T00000
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Material | Copper |
| Shape | Rectangular, Fins |
| Package Cooled | TO-263 (D2Pak) |
| Material Finish | Tin |
| Published | 2006 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Board Level |
| Attachment Method | SMD Pad |
| Height Off Base (Height of Fin) | 0.375 9.52mm |
| Thermal Resistance @ Forced Air Flow | 5.00°C/W @ 400 LFM |
| Power Dissipation @ Temperature Rise | 2.0W @ 40°C |
| Height | 9.5mm |
| Length | 0.590 15.00mm |
| Width | 1.020 25.91mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
