834000T00000
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Material | Copper |
| Shape | Rectangular, Fins |
| Package Cooled | TO-263 (D2Pak) |
| Material Finish | Tin |
| Published | 2006 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Board Level |
| Attachment Method | SMD Pad |
| Height Off Base (Height of Fin) | 0.450 11.43mm |
| Thermal Resistance @ Forced Air Flow | 4.00°C/W @ 200 LFM |
| Natural Thermal Resistance | 12 °C/W |
| Power Dissipation @ Temperature Rise | 1.5W @ 20°C |
| Height | 11.4mm |
| Length | 0.763 19.38mm |
| Width | 1.000 25.40mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
