89HPEB383ZAEM
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Package / Case | TQFP |
| Number of Pins | 128 |
| Weight | 503.487531mg |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 3 |
| Number of Terminations | 128 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 240 |
| Supply Voltage | 1.05V |
| Terminal Pitch | 0.4mm |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Pin Count | 128 |
| Operating Supply Voltage | 5V |
| Temperature Grade | COMMERCIAL |
| Interface | PCI Express |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
| Frequency (Max) | 33MHz |
| Data Bus Width | 32b |
| Bus Compatibility | ISA; PCI; SBUS; VGA; USB |
| Data Transfer Rate-Max | 2500 MBps |
| Height | 1mm |
| Length | 14mm |
| Width | 14mm |
| Thickness | 1mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
89HPEB383ZAEM Overview
The TQFPpackage fits the device well.A total of 128terminations have been recorded.It is recommended that you set this device to 1.05V.In total, there are 128pins on the board.In order for the operation to be performed, the 128pins must be connected.By [0], it is mounted.In order to ensure reliability, the unit works at a minimum working temperature of [0].In addition to ensuring the consistency of the part, 85°Cis the maximum value possible.Interface ICs operate at a voltage level of 5V volts.These devices are incorporated with uPs/uCs/Peripheral ICs of type BUS CONTROLLER, PCI.
89HPEB383ZAEM Features
Set the part at 1.05V volts
BUS CONTROLLER, PCI of uPs/uCs/Peripheral ICs Type
89HPEB383ZAEM Applications
There are a lot of Integrated Device Technology (IDT) 89HPEB383ZAEM Specialized Interface ICs applications.
- DVD-R
- Microprocessor Controlled Analog Systems
- Communication systems
- Switching Systems
- Precision data acquisition
- Battery Powered Systems
- Voice over IP/DSL – Integrated Access Devices, Smart
- ?Digital access cross connects
- ?Microwave transmission systems
- Fault Tolerant Systems
