Parameters | |
---|---|
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Number of Pins | 288 |
Packaging | Tape & Reel (TR) |
Published | 1999 |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 |
Number of Terminations | 288 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Max Operating Temperature | 70°C |
Min Operating Temperature | 0°C |
HTS Code | 8542.39.00.01 |
Subcategory | Bus Controllers |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 1V |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 288 |
Qualification Status | Not Qualified |
Supply Voltage-Max (Vsup) | 1.1V |
Power Supplies | 12.53.3V |
Temperature Grade | COMMERCIAL |
Supply Voltage-Min (Vsup) | 0.9V |
Interface | PCI Express |
uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
Clock Frequency | 125MHz |
Supply Current-Max | 908mA |
Bus Compatibility | PCI; SMBUS |
Data Transfer Rate-Max | 16000 MBps |
Height Seated (Max) | 1.7mm |
Length | 23mm |
Width | 23mm |
Thickness | 1.1mm |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |