Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Lead, Tin |
Mount | Surface Mount |
Package / Case | FCBGA |
Number of Pins | 324 |
Published | 1999 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 4 |
Number of Terminations | 324 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Lead (Sn63Pb37) |
Max Operating Temperature | 70°C |
Min Operating Temperature | 0°C |
HTS Code | 8542.39.00.01 |
Subcategory | Bus Controllers |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 225 |
Supply Voltage | 1V |
Terminal Pitch | 1mm |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 324 |
Qualification Status | Not Qualified |
Supply Voltage-Max (Vsup) | 1.1V |
Power Supplies | 13.3V |
Temperature Grade | COMMERCIAL |
Supply Voltage-Min (Vsup) | 0.9V |
Interface | PCI Express |
uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
Clock Frequency | 125MHz |
Bus Compatibility | PCI |
Height Seated (Max) | 3.42mm |
Length | 19mm |
Width | 19mm |
Thickness | 3.27mm |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |