Parameters |
Mount |
Surface Mount |
Package / Case |
QFN |
Number of Pins |
40 |
Packaging |
Bulk |
Published |
2006 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
3 |
Number of Terminations |
40 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) - annealed |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
HTS Code |
8542.39.00.01 |
Terminal Position |
QUAD |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Pin Count |
40 |
Resolution |
3 B |
Telecom IC Type |
PCM CODEC |
Length |
5mm |
Width |
5mm |
Thickness |
900μm |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
92HD73E2X5NDGXC1X Overview
As a space saver, it comes in the QFN package. Bulk packaging is adopted. 40 terminations prevent signals from reflecting off transmission lines. 40-pin electronic devices are what it is. It is configured with 40 pins. Using Surface Mount technology, it is mounted to a PCB. It is set to the maximum value of 70°C so normal use can be maintained. The operating temperature is set with the minimum value of 0°C to keep normal use.
92HD73E2X5NDGXC1X Features
Embedded in the QFN package
92HD73E2X5NDGXC1X Applications
There are a lot of Integrated Device Technology (IDT) 92HD73E2X5NDGXC1X CODECs Interface ICs applications.
- Robotics
- Automatic health monitoring systems
- Food & beverage
- Image search
- Converting
- Flight simulators
- Medical & Lab Equipment
- CPU memory location identification
- Microprocessor
- Linear measurement