Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Tin |
Mount |
Surface Mount |
Package / Case |
SSOP |
Number of Pins |
28 |
Published |
2011 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 |
Number of Terminations |
28 |
ECCN Code |
EAR99 |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Technology |
CMOS |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
3.3V |
Terminal Pitch |
0.65mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
28 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
3.465V |
Power Supplies |
3.3V |
Temperature Grade |
COMMERCIAL |
Number of Circuits |
1 |
Frequency (Max) |
400MHz |
Input |
Clock |
Primary Clock/Crystal Frequency-Nom |
25MHz |
PLL |
Yes |
Length |
10.2mm |
Width |
5.3mm |
Thickness |
1.73mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
9FG430AFLF Overview
There is a case with SSOP included. Clock program has 28 terminations. 3.3V is the voltage provided by this part. Using the part's peak reflow temperature, operation 260 is performed. As of right 1w, the device has 1. In a normaloperation, there is 400MHz maximum frequency. When the maximal supply voltage (Vsup) reaches 3.465V, the device is considered to be functional. There are 2011 published parts for this part. Ideally, it should be mounted with Surface Mount. A device with 28 pins is designed. A total of 28 pins are included. Temperatures below 0°C are not acceptable for this device. Circuits application is recommended to operate at a temperature lower than 70°C.
9FG430AFLF Features
Peak Reflow Temperature (Cel): 260
Include 1 Circuits
with 28 Pins
9FG430AFLF Applications
There are a lot of Integrated Device Technology (IDT) 9FG430AFLF application specific timer?applications.
- Multi-function Printer
- Ethernet switch/router
- OTN Muxponders and Transponders
- Processor and FPGA clocking
- Print Imaging
- Communications
- PCI Express 2.0/3.0
- Industrial, Embedded Computing
- Network Attached Storage
- MSAN/DSLAM/PON