banner_page

A14557-01

Thermal Interface Products Tflex 530 9x9" 2.8W/mK gap filler


  • Manufacturer: Laird Technologies - Thermal Materials
  • Nocochips NO: 480-A14557-01
  • Package: -
  • Datasheet: PDF
  • Stock: 803
  • Description: Thermal Interface Products Tflex 530 9x9" 2.8W/mK gap filler (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Silicone Elastomer
Shape Square
Published 2010
Series Tflex™ 500
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Max Operating Temperature 200°C
Min Operating Temperature -45°C
Color Blue
Adhesive Tacky - Both Sides
Backing, Carrier Fiberglass
Outline 228.60mm x 228.60mm
Thermal Conductivity 2.8W/m-K
Length 229mm
Width 229mm
Thickness 0.0300 0.762mm
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good