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A14559-01

Thermal Interface Products Tflex 550 9x9" 2.8W/mK gap filler


  • Manufacturer: Laird Technologies - Thermal Materials
  • Nocochips NO: 480-A14559-01
  • Package: -
  • Datasheet: PDF
  • Stock: 133
  • Description: Thermal Interface Products Tflex 550 9x9" 2.8W/mK gap filler (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Silicone Elastomer
Shape Square
Packaging Bulk
Published 2010
Series Tflex™ 500
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Max Operating Temperature 200°C
Min Operating Temperature -50°C
Color Blue
Adhesive Tacky - Both Sides
Outline 228.60mm x 228.60mm
Thermal Conductivity 2.8W/m-K
Thickness 0.0500 1.270mm
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
See Relate Datesheet

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