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A15754-05

TFLEX SF850


  • Manufacturer: Laird Technologies - Thermal Materials
  • Nocochips NO: 480-A15754-05
  • Package: -
  • Datasheet: PDF
  • Stock: 611
  • Description: TFLEX SF850 (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Non-Silicone
Shape Square
Series Tflex™ SF800
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Adhesive Tacky - Both Sides
Outline 228.60mm x 228.60mm
Thermal Conductivity 7.8W/m-K
Thermal Resistivity 0.19°C/W
Thickness 0.0500 1.270mm
RoHS Status RoHS Compliant
See Relate Datesheet

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