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A16366-13

TFLEX SF6130


  • Manufacturer: Laird Technologies - Thermal Materials
  • Nocochips NO: 480-A16366-13
  • Package: -
  • Datasheet: PDF
  • Stock: 983
  • Description: TFLEX SF6130 (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Non-Silicone, Boron Nitride Filled
Shape Square
Series Tflex™ SF600
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Pink
Outline 457.20mm x 457.20mm
Thermal Conductivity 3.0W/m-K
Thickness 0.130 3.30mm
RoHS Status RoHS Compliant
See Relate Datesheet

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