Parameters | |
---|---|
Thermal Conductivity | 3.0W/m-K |
Width | 229mm |
Thickness | 0.120 3.05mm |
REACH SVHC | Unknown |
RoHS Status | RoHS Compliant |
Factory Lead Time | 1 Week |
Material | Non-Silicone, Boron Nitride Filled |
Shape | Square |
Published | 2008 |
Series | Tflex™ SF600 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Type | Gap Filler Pad, Sheet |
Resistance | 1 TΩ |
Color | Pink |
Outline | 228.60mm x 228.60mm |