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A17819-20

TFLEX HD95000,DC1


  • Manufacturer: Laird Technologies - Thermal Materials
  • Nocochips NO: 480-A17819-20
  • Package: -
  • Datasheet: PDF
  • Stock: 113
  • Description: TFLEX HD95000,DC1 (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ HD90000
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Usage CPU
Adhesive Tacky - One Side
Outline 228.60mm x 228.60mm
Thermal Conductivity 7.5W/m-K
Thickness 0.200 5.08mm
RoHS Status RoHS Compliant
See Relate Datesheet

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