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A17820-19

TFLEX HD94750,DC1


  • Manufacturer: Laird Technologies - Thermal Materials
  • Nocochips NO: 480-A17820-19
  • Package: -
  • Datasheet: PDF
  • Stock: 202
  • Description: TFLEX HD94750,DC1 (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ HD90000
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Usage CPU
Adhesive Tacky - One Side
Outline 457.20mm x 457.20mm
Thermal Conductivity 7.5W/m-K
Thickness 0.190 4.83mm
RoHS Status RoHS Compliant
See Relate Datesheet

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