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A17880-17

TFLEX HD3170MTG 9X9"


  • Manufacturer: Laird Technologies - Thermal Materials
  • Nocochips NO: 480-A17880-17
  • Package: -
  • Datasheet: PDF
  • Stock: 614
  • Description: TFLEX HD3170MTG 9X9" (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ HD300
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Pink
Adhesive Tacky - Both Sides
Backing, Carrier Liner
Outline 228.60mm x 228.60mm
Thermal Conductivity 2.7W/m-K
Thickness 0.170 4.32mm
RoHS Status RoHS Compliant
See Relate Datesheet

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