Parameters |
Factory Lead Time |
1 Week |
Package / Case |
288-TFBGA, CSPBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion® |
JESD-609 Code |
e0 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
288 |
Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag) |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
235 |
Supply Voltage |
1.5V |
Terminal Pitch |
0.5mm |
Frequency |
80MHz |
Time@Peak Reflow Temperature-Max (s) |
20 |
Base Part Number |
A2F060M3E |
Number of Outputs |
68 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.575V |
Supply Voltage-Min (Vsup) |
1.425V |
Interface |
EBI/EMI, I2C, SPI, UART, USART |
Number of I/O |
MCU - 28, FPGA - 68 |
RAM Size |
16KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, I2C, SPI, UART/USART |
Architecture |
MCU, FPGA |
Number of Inputs |
68 |
Organization |
1536 CLBS, 60000 GATES |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Core Architecture |
ARM |
Number of Logic Blocks (LABs) |
8 |
Primary Attributes |
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Number of Equivalent Gates |
60000 |
Flash Size |
128KB |
Height Seated (Max) |
1.05mm |
Length |
11mm |
Width |
11mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.There is a 288-TFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 16KB RAM and guarantees reliable performance to the user.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion? series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.Taking note of the fact that this SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops is important.Tray package houses this SoC system on a chip.MCU - 28, FPGA - 68 I/Os are included in this SoC part.A power supply with a 1.5V voltage rating should be utilized when using this system on chip SoC.An excessive voltage of 1.575V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.This SoC system on a chip can run on a power supply that is at least 1.425V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.system on a chip benefits from 288 terminations.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.It is possible to use this SoC chip with 68 outputs.The SoC chip offers 68 inputs.As for its flash size, it is 128KB.By searching A2F060M3E, you will find system on chips with similar specs and purposes.A frequency of 80MHz is used by the wireless SoC to operate.In this SoC meaning, ARM serves as the core architecture.
ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-CS288I System On Chip (SoC) applications.
- Functional safety for critical applications in the automotive
- DC-input BLDC motor drive
- High-end PLC
- Microcontroller based SoC ( RISC-V, ARM)
- AC drive control module
- Fitness
- Mobile market
- Measurement tools
- Optical drive
- Automated sorting equipment