Parameters |
Number of I/O |
MCU - 28, FPGA - 68 |
Speed |
80MHz |
RAM Size |
16KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, I2C, SPI, UART/USART |
Architecture |
MCU, FPGA |
Core Architecture |
ARM |
Max Frequency |
100MHz |
Number of Logic Blocks (LABs) |
8 |
Primary Attributes |
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Flash Size |
128KB |
RoHS Status |
RoHS Compliant |
Factory Lead Time |
1 Week |
Package / Case |
288-TFBGA, CSPBGA |
Supplier Device Package |
288-CSP (11x11) |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Max Operating Temperature |
85°C |
Min Operating Temperature |
0°C |
Frequency |
80MHz |
Base Part Number |
A2F060M3E |
Interface |
EBI/EMI, I2C, SPI, UART, USART |
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.The manufacturer assigns this system on a chip with a 288-TFBGA, CSPBGA package as per the manufacturer's specifications.This SoC chip is equipped with 16KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design is based on the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops.An advanced Tray package houses this SoC system on a chip.MCU - 28, FPGA - 68 I/Os are included in this SoC part.A flashing 128KB appears on it.A2F060M3E can help you find system on chips with similar specs and purposes.A frequency of 80MHz is used by the wireless SoC to operate.There is no doubt that the SoC meaning is based on the core architecture of ARM.In order for the SoC computing to start, 0°C is just about right.85°C is the designing maximum operating temperature of this SoC system on chip.
ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-CSG288 System On Chip (SoC) applications.
- Sports
- Industrial sectors
- Automotive
- Digital Media
- Temperature
- Networked Media Encode/Decode
- Embedded systems
- Flow Sensors
- Networked sensors
- Healthcare