A2F060M3E-FGG256
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion® |
| JESD-609 Code | e1 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.5V |
| Terminal Pitch | 1mm |
| Frequency | 80MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | A2F060M3E |
| Operating Supply Voltage | 1.5V |
| Interface | EBI/EMI, I2C, SPI, UART, USART |
| Max Supply Voltage | 1.575V |
| Min Supply Voltage | 1.425V |
| Memory Size | 4.5kB |
| Operating Supply Current | 3mA |
| Number of I/O | MCU - 26, FPGA - 66 |
| RAM Size | 16KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART |
| Data Rate | 400 kbps |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 660 |
| Core Architecture | ARM |
| Number of Gates | 60000 |
| Primary Attributes | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
| Flash Size | 128KB |
| Height Seated (Max) | 1.7mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.Manufacturer assigns package 256-LBGA to this system on a chip.With 16KB RAM implemented, this SoC chip provides reliable operation.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series in which this system on chip SoC falls under.The average operating temps for this SoC meaning should be 0°C~85°C TJ.A key point to note is that this SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops.It comes in a state-of-the-art Tray package.An integral part of this SoC consists of a total of MCU - 26, FPGA - 66 I/Os.A power supply with a 1.5V rating is recommended.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.In total, there are 256 terminations, which is great for system on a chip.This flash has a size of 128KB.By searching A2F060M3E, you will find system on chips with similar specs and purposes.A frequency of 80MHz is used by the wireless SoC to operate.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 256.It is rated with 1.575V maximum supply voltage.The SoC security receives at least 1.425V watts of power.
ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-FGG256 System On Chip (SoC) applications.
- Vending machines
- Digital Signal Processing
- Transmitters
- Keyboard
- Industrial automation devices
- Temperature Sensors
- Vending machines
- Servo drive control module
- Digital Media
- Central alarm system
