Parameters |
Factory Lead Time |
1 Week |
Package / Case |
288-TFBGA, CSPBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2013 |
Series |
SmartFusion® |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
288 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1.5V |
Terminal Pitch |
0.5mm |
Frequency |
100MHz |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
A2F200 |
JESD-30 Code |
S-PBGA-B288 |
Number of Outputs |
78 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1.5V |
Power Supplies |
1.51.82.53.3V |
Interface |
EBI/EMI, Ethernet, I2C, SPI, UART, USART |
Max Supply Voltage |
1.575V |
Min Supply Voltage |
1.425V |
Number of I/O |
MCU - 31, FPGA - 78 |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I2C, SPI, UART/USART |
Architecture |
MCU, FPGA |
Number of Inputs |
78 |
Organization |
4608 CLBS, 200000 GATES |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Core Architecture |
ARM |
Primary Attributes |
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Number of Equivalent Gates |
200000 |
Flash Size |
256KB |
Height Seated (Max) |
1.05mm |
Length |
11mm |
Width |
11mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.According to the manufacturer, this system on a chip has a package of 288-TFBGA, CSPBGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion? is the series number of this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 31, FPGA - 78 I/Os are available in this SoC part.A 1.5V power supply should be used.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.system on a chip benefits from 288 terminations.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.You can have 78 user outputs for this SoC chip.System on chip requires 1.51.82.53.3V power supplies.Inputs are available on the SoC chip in the number of 78.A flashing 256KB appears on it.Searching A2F200 will bring up system on chips with similar specs and purposes.The wireless SoC works at a frequency of 100MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The maximum supply voltage is rated as 1.575V.A minimum of 1.425V are supplied to it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-1CSG288I System On Chip (SoC) applications.
- Networked sensors
- DC-input BLDC motor drive
- Functional safety for critical applications in the automotive
- Smartphones
- AC drive control module
- Automotive gateway
- Optical drive
- USB hard disk enclosure
- Published Paper
- System-on-chip (SoC)