A2F200M3F-1FG256
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 256-LBGA |
| Surface Mount | YES |
| Number of Pins | 256 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | SmartFusion® |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | TIN LEAD/TIN LEAD SILVER |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 1.5V |
| Terminal Pitch | 1mm |
| Frequency | 100MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | A2F200 |
| Number of Outputs | 66 |
| Supply Voltage-Max (Vsup) | 1.575V |
| Supply Voltage-Min (Vsup) | 1.425V |
| Interface | EBI/EMI, Ethernet, I2C, SPI, UART, USART |
| Operating Supply Current | 3mA |
| Number of I/O | MCU - 25, FPGA - 66 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Number of Gates | 200000 |
| Number of Logic Blocks (LABs) | 8 |
| Primary Attributes | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
| Flash Size | 256KB |
| Height Seated (Max) | 1.7mm |
| Length | 17mm |
| Width | 17mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.Its package is 256-LBGA.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is a member of the SmartFusion? series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.As one of the most important things to note is that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops together.Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 25, FPGA - 66 inputs and outputs.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.575V.In order to run it, it must be fed by at least 1.425V of power.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.As a result, there are 256 terminations in total, which does really benefit system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.In order for this SoC chip to work properly, you can have 66 outputs.The flash is set to 256KB.A2F200 can help you find system on chips with similar specs and purposes.A frequency of 100MHz is used by the wireless SoC to operate.In terms of core architecture, the SoC meaning relies on ARM.The computer SoC is the 256-pin version.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-1FG256 System On Chip (SoC) applications.
- High-end PLC
- Efficient hardware for training of neural networks
- Measurement tools
- Microcontroller
- Optical drive
- Mobile computing
- Special Issue Editors
- RISC-V
- Multiprocessor system-on-chips (MPSoCs)
- Vending machines
