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A2F200M3F-1FGG256

0°C~85°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-A2F200M3F-1FGG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 428
  • Description: 0°C~85°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V(Kg)

Details

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Parameters
Factory Lead Time 1 Week
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2013
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 100MHz
Base Part Number A2F200
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 4.5kB
Operating Supply Current 3mA
Number of I/O MCU - 25, FPGA - 66
Speed 100MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 2500
Core Architecture ARM
Number of Gates 200000
Max Frequency 120MHz
Speed Grade 1
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Registers 4608
Flash Size 256KB
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).This system on a chip is packaged as 256-LBGA by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.Internally, this SoC design uses the MCU, FPGA technique.SmartFusion? is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.Taking note of the fact that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.An advanced Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of MCU - 25, FPGA - 66 I/Os.This flash has a size of 256KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F200.It operates at a frequency of 100MHz.In terms of core architecture, the SoC meaning relies on ARM.Currently, the computer SoC is available in a 256-pin version.Just 0°C will start the SoC computing.85°C is the designing maximum operating temperature of this SoC system on chip.Supply voltage is rated at 1.575V.Power is provided to it at least to the extent that 1.425V is required.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-1FGG256 System On Chip (SoC) applications.

  • ARM Cortex M4 microcontroller
  • ARM processors
  • Three phase UPS
  • Keywords
  • Healthcare
  • Mouse
  • Industrial transport
  • Digital Media
  • Networked sensors
  • Embedded systems

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