A2F200M3F-1FGG484I
| Parameters | |
|---|---|
| Frequency | 100MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | A2F200 |
| Number of Outputs | 94 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.5V |
| Interface | EBI/EMI, Ethernet, I2C, SPI, UART, USART |
| Max Supply Voltage | 1.575V |
| Min Supply Voltage | 1.425V |
| Operating Supply Current | 1mA |
| Number of I/O | MCU - 41, FPGA - 94 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Number of Gates | 200000 |
| Number of Logic Blocks (LABs) | 8 |
| Primary Attributes | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 23mm |
| Width | 23mm |
| RoHS Status | RoHS Compliant |
| Factory Lead Time | 1 Week |
| Package / Case | 484-BGA |
| Surface Mount | YES |
| Number of Pins | 484 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion® |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.5V |
| Terminal Pitch | 1mm |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.This system on a chip is packaged as 484-BGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion? is the series in which this system on chip SoC falls under.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part is comprised of MCU - 41, FPGA - 94 inputs and outputs.Ideally, a power supply with a voltage of 1.5V should be used.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.As a result, there are 484 terminations in total, which does really benefit system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.There are 94 outputs available on this SoC.It has a 256KB flash.By searching A2F200, you will find system on chips with similar specs and purposes.The wireless SoC works at a frequency of 100MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC is the 484-pin version.Voltages up to 1.575V are specified for this SoC security.Power is supplied to it at least in the amount of 1.425V.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-1FGG484I System On Chip (SoC) applications.
- Smartphone accessories
- Level
- Sensor network-on-chip (sNoC)
- Keywords
- AC drive control module
- Industrial automation devices
- Fitness
- Self-aware system-on-chip (SoC)
- Smartphones
- Avionics
